Modeling of Thermal Oxidation and Stress Effects
Hollauer, Christian
Thermal Oxidation is one of the most importantprocess steps in semiconductor fabrication to producehigh quality isolation layers. A chemical reactionconverts silicon into silicon dioxide which has morethan twice of the original volume. This is the mainsource for stress and displacements in the oxidizedstructure. Stress in copper interconnects can be essential forthe life time of an integrated circuit, because itcan support material transport a...