Assembly and Reliability of Lead-Free Solder Joints
Lee, Ning-Cheng / Lau, John H.![Assembly and Reliability of Lead-Free Solder Joints](https://support.digitalhusky.com/media/annotations/sorted/367/36704645/CHSBZCOP0336704645.jpg)
This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free sol...