16 Ergebnisse.

Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. This book examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them. It provides a framework for how to model the mechanism, test for defects, and avoid and manage damage. T...

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The book comprehensively covers the various aspects of risk modeling and analysis in technological contexts. It pursues a systems approach to modeling risk and reliability concerns in engineering, and covers the key concepts of risk analysis and mathematical tools used to assess and account for risk in engineering problems. The relevance of incorporating risk-based structures in design and operations is also stressed, with special emphasis on ...

AN INDISPENSABLE GUIDE FOR ENGINEERS AND DATA SCIENTISTS IN DESIGN, TESTING, OPERATION, MANUFACTURING, AND MAINTENANCE A road map to the current challenges and available opportunities for the research and development of Prognostics and Health Management (PHM), this important work covers all areas of electronics and explains how to: assess methods for damage estimation of components and systems due to field loading conditions assess the cost an...

Documents the technologies, capabilities, and infrastructure that has made China a major player in the Asian electronics industry. This book covers the major segments of China's electronics industry, including semiconductors, packaging, printed circuit boards, computer hardware and software, telecommunications, and electronic systems.

This book documents the technologies, manufacturing procedures, capabilities, and infrastructure that has made China a leader in the Asian electronics industry. Electronics Industry in China covers the major segments of the industry: semiconductors, packaging, displays, printed circuit boards, and electronic systems. Other topics include the role of government, various associations, research organizations, educational institutions, and major e...

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This practical book examines packaging architecture, outlining the classification of materials and their uses for various tasks requiring performance over time. Topics include reliability, design, and cost, heat dissipation problems, and signal delay. TOC:Introduction.- Properties of Electronic Packaging Materials.- Zeroth-Level Packaging Materials.- First-Level Packaging Materials. Second-Level Packaging Materials.- Third-Level Packaging Mate...

This is an excellent text detailing situations the professional will encounter in practice. The book: * Includes an extensive table detailing the types of mechanism failures, such as self-heating and hot carrier aging. * Examines deep sub-micron challenges, such as power dissipation, switching noise, and cross talk * Outlines how to establish the specifications defining chip performance, cost, quality, and reliability. * Concentrates on device...

Increase profitability and reduce risk through effective parts selection and management Corporations recognize that technology can be the key to fueling product design and development. But just as crucial– if not more– to a company’ s success are the decisions about when, what, and how a technology will be used. Few companies have failed because the right technology was not available, many have failed when a technology was not effectively sele...

The first book on Prognostics and Health Management of Electronics. Recently, the field of prognostics for electronic products has received increased attention due to the potential to provide early warning of system failures, forecast maintenance as needed, and reduce life cycle costs. In response to the subject's growing interest among industry, government, and academic professionals, this book provides a road map to the current challenges a...

Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances.

All packaging engineers and technologists who want to ensure that they give their customers the highest quality, most cost-effective products should know that the paradigm has shifted. It has shifted away from the MIL-STDs and other government standards and test procedures that don't cost-effectively address potential failure mechanisms or the manufacturing processes of the product. It has shifted decisively towards tackling the root causes of...

This practical guide presents and compares the fundamental theories and techniques of placement and routing and provides important new approaches to solving specific problems., Focusing on highly reliable methods for good manufacturing capability, Placement and Routing of Electronic Modules: discusses the mathematical basis for placement and routing, including set, combinatorial and graph theories, explicates the definitions, structures and re...

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book′s microelectronic package design-for-reliability guidelines and approaches essential for achieving their life-cycle, cost-effectiveness, and on-time delivery goals.