Electronic Packaging Materials and Their Properties
Pecht, Michael / Agarwal, Rakish / McCluskey, F. Patrick / Dishongh, Terrance J. / Javadpour, Sirus / Mahajan, Rahul
This practical book examines packaging architecture, outlining the classification of materials and their uses for various tasks requiring performance over time. Topics include reliability, design, and cost, heat dissipation problems, and signal delay. TOC:Introduction.- Properties of Electronic Packaging Materials.- Zeroth-Level Packaging Materials.- First-Level Packaging Materials. Second-Level Packaging Materials.- Third-Level Packaging Mate...