The European Union's directive banning the use of lead-based (Pb) solders in electronic consumer products has created an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders. This book provides a comprehensive examination of advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints, and presents methods for preventing common reliablity problems.
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ISBN | 9781441922847 |
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Sprache | eng |
Cover | C, Metallic Materials, Circuits and Systems, Quality Control, Reliability, Safety and Risk, Manufacturing, Machines, Tools, Processes, Electronics and Microelectronics, Instrumentation, Metals and Alloys, Electronic Circuits and Systems, Industrial and Production Engineering, Machines, Tools, Processes, Chemistry and Materials Science, Metals, Electronic circuits, quality control, reliability, Industrial safety, Manufactures, Electronics, Microelectronics, Electronics: circuits & components, Reliability engineering, Production engineering, Electronics engineering, Kartonierter Einband (Kt) |
Verlag | Springer Nature EN |
Jahr | 2010 |
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