These proceedings present current research on issues related to stress-induced phenomena in on-chip metal interconnects and solder joints. The volume will appeal to scientists, engineers, graduate students interested in research and development of microelectronic devices as well as technology integration, and semiconductor industry professionals and equipment suppliers.
Lieferbar
ISBN | 9780735403109 |
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Sprache | eng |
Cover | Fester Einband |
Verlag | Springer Pg |
Jahr | 200602 |
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